JPH0397982U - - Google Patents
Info
- Publication number
- JPH0397982U JPH0397982U JP560790U JP560790U JPH0397982U JP H0397982 U JPH0397982 U JP H0397982U JP 560790 U JP560790 U JP 560790U JP 560790 U JP560790 U JP 560790U JP H0397982 U JPH0397982 U JP H0397982U
- Authority
- JP
- Japan
- Prior art keywords
- casting material
- circuit board
- electronic circuit
- flexible
- bottomed cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005266 casting Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP560790U JPH0397982U (en]) | 1990-01-26 | 1990-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP560790U JPH0397982U (en]) | 1990-01-26 | 1990-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397982U true JPH0397982U (en]) | 1991-10-09 |
Family
ID=31509308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP560790U Pending JPH0397982U (en]) | 1990-01-26 | 1990-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397982U (en]) |
-
1990
- 1990-01-26 JP JP560790U patent/JPH0397982U/ja active Pending